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ProductsBakery & BreadBaked Goods & DessertsStuffed Muffin With Biscoff Cookie Butter
Stuffed Muffin With Biscoff Cookie Butter

Ingredient List: Stuffed Muffin With Biscoff Cookie Butter

Stuffed Muffin With Biscoff Cookie Butter

Ingredients

Cake base (sugar, enriched flour bleached (wheat flour, niacin, iron, thiamin mononitrate, riboflavin, folic acid) soybean oil, modified corn starch. Contains 2% or less of: mono and diglycerides, leavening (baking soda sodium aluminum phosphate), modified whey, salt, sodium stearoyl lactylate, sorbitan monostearate, calcium acetate, nonfat milk, xanthan gum, guar gum, natural and artificial flavor, vital wheat gluten, polysorbate 60, egg, soy flour) whole eggs, soybean oil, water, biscoff biscuit spread (biscoff biscuits (wheat flour, sugar, vegetable oils (palm oil from sustainable and certified plantations, rapeseed oil), candy sugar syrup, raising agent (sodium hydrogen carbonate), soy flour, salt, cinnamon) rapeseed oil, sugar, soy lecithin, citric acid), brown sugar, sour cream (grade a cultured cream), biscoff cookie crumbles (wheat flour, sugar, vegetable oils (contains one or more of soybean oil, sunflower oil, canola oil, palm oil), brown sugar syrup, sodium bicarbonate (leavening), soy flour, salt, cinnamon). Biscoff caramelized biscuit sauce (biscoff carmelized biscuits (wheat flour, sugar, vegetable oils (palm and rapeseed), candy sugar syrup, raising agent (sodium hydrogen carbonate), soy flour, salt, cinnamon), rapeseed oil, sugar, soy lecithin (emulsifier), citric acid), palm fruit oil, enriched patent flour (wheat flour, niacin, reduced iron, thiamine mononitrate, riboflavin, folic acid, malted barley flour), cinnamon, vanilla flavor (propylene glycol, natural flavor), malted milk powder (wheat flour and malted barley extracts, milk soy lecithin, salt, sodium bicarbonate)

Allergens

Manufacturer likely did not include an allergen statement; however, please double-check the product packaging and/or contact the manufacturer if you have a severe food allergy.

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