Ingredient List: H-E-B Bakery Pumpkin Chai Tres Leches Cake
Ingredients
Pumpkin chai tres leches cake(creme cake mix(sugar, enriched bleached wheat flour(wheat flour, niacin, reduced iron, thiamine mononitrate, riboflavin, folic acid), modified corn starch, soybean oil, dairy product solids(milk), contains 2% or less of:, leavening(sodium aluminum phosphate, sodium bicarbonate), emulsifiers(propylene glycol esters of fatty acids, mono & diglycerides, sodium stearoyl lactylate), vital wheat gluten, artificial flavor, egg whites, soy flour), condensed milk(whole milk, sugar), eggs, whole milk, evaporated milk(milk, dipotassium phosphate, carrageenan, vitamin d3), baking powder(sodium acid pyrophosphate, sodium bicarbonate, corn starch, monocalcium phosphate), soy lecithin, artificial vanilla flavor(water, propylene glycol, ethanol, artificial flavor, caramel color), pumpkin pie and chai syrup(cane sugar, dextrose(wheat, corn), fructose, water, natural flavor), potassium sorbate(preservative)) sweetened whipping cream(cream(milk), corn syrup, sugar, skim milk, milk(milk, vitamin d3), contains 2% or less of:, modified food starch(corn, tapioca), natural & artificial flavors, sodium citrate, xanthan gum, polysorbate 80) french sponge cake(cake mix(enriched bleached wheat flour(wheat flour, niacin, reduced iron, thiamine mononitrate, riboflavin, folic acid), eggs, water, sugar, emulsifier blend(rice starch, glucose syrup solids, mono & diglycerides, skim milk, polyglycerol ester, tetrasodium pyrophosphate), wheat starch, contains 2% or less of:, leavening(sodium bicarbonate, sodium aluminum phosphate), soy protein, cellulose gum, soybean oil, artificial flavor, beta carotene(color), cultured corn syrup solids, citric acid, tricalcium phosphate)) pumpkin pie spice(cinnamon, nutmeg, allspice, cloves, ginger). Contains a bioengineered food ingredient.
Allergens
<b>contains:</b> wheat, egg, soy, milk.<br><br><b>safe handling:</b> perishable.
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